Patent Assignment
Reel/Frame 046252/0628
Assignment of Assignor's Interest
Recorded: 2018-07-02
Pages: 5
Assignors
BYUN, DAE JUNG
Executed: 2017-04-17
KIM, BYUNG HO
Executed: 2017-04-17
HAN, PYUNG HWA
Executed: 2017-04-17
CHOI, JOO YOUNG
Executed: 2017-04-17
SHIN, UNG HUI
Executed: 2017-04-17
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.