Patent Assignment
Reel/Frame 046252/0910
Assignment of Assignor's Interest
Recorded: 2018-07-02
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device That Uses Bonding Layer to Join Semiconductor Substrates Together