Patent Assignment
Reel/Frame 046271/0197
Assignment of Assignor's Interest
Recorded: 2018-07-05
Pages: 8
Assignors
YANG, DEOKKYUNG
Executed: 2018-07-03
LEE, HUNTEAK
Executed: 2018-07-03
KIM, OHHAN
Executed: 2018-07-03
LEE, HEESOO
Executed: 2018-07-03
HA, DAEHYEOK
Executed: 2018-07-04
LEE, WANIL
Executed: 2018-07-03
Assignee
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65, TECHPOINT #04-08/09, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.