Patent Assignment
Reel/Frame 046287/0538
Assignment of Assignor's Interest
Recorded: 2018-07-06
Pages: 4
Assignors
HUNG, CHIH-MING
Executed: 2018-05-16
WANG, MENG-JEN
Executed: 2018-05-16
TSAI, TSUNG-YUEH
Executed: 2018-05-16
OU, JEN-KAI
Executed: 2018-05-16
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method for Manufacturing the Same