Patent Assignment
Reel/Frame 046314/0352
Assignment of Assignor's Interest
Recorded: 2018-06-06
Pages: 4
Assignors
LIAO, GUO-CHENG
Executed: 2018-05-24
CHEN, CHIA CHING
Executed: 2018-05-24
DING, YI CHUAN
Executed: 2018-05-26
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Method for Manufacturing the Same