Semiconductor package structure and method for manufacturing the same
A semiconductor package structure includes a first conductive structure, a second conductive structure, a first semiconductor component, a second semiconductor component and a first encapsulant. The first semiconductor component is disposed on the first conductive structure. The first conductive structure includes a first redistribution layer. The second semiconductor component is disposed on the second conductive structure. The second conductive structure includes a second redistribution layer, and the first conductive structure is electrically connected to the second conductive structure. The first encapsulant covers the first semiconductor component and the first conductive structure. A lateral surface of the first conductive structure and a lateral surface of the first encapsulant are non-coplanar.
1. A method for manufacturing a semiconductor package structure, comprising:
(a) forming a base wiring structure on a first carrier, wherein the base wiring structure includes a first redistribution layer;
(b) singulating the base wiring structure to form a plurality of first conductive structures;
(c) disposing the first conductive structures on a second carrier;
(d) disposing a first semiconductor component on one first conductive structure of the first conductive structures;
(e) forming a first encapsulant to cover the first semiconductor component and a lateral surface of the first conductive structure;
(f) removing the second carrier;
(g) singulating the first encapsulant to form a plurality of unit packages;
(h) disposing the unit packages on a third carrier;
(i) disposing a second semiconductor component on the third carrier;
(j) forming a second encapsulant to cover the second semiconductor component and the unit packages;
(k) removing the third carrier;
(l) forming an outer wiring structure on the unit packages and the second encapsulant, wherein the outer wiring structure includes a second redistribution layer; and
(m) singulating the outer wiring structure and the second encapsulant.
2. The method of claim 1 , wherein after (h), the method further comprises:
(h1) forming a shielding layer to cover the unit packages.
3. The method of claim 2 , wherein the shielding layer contacts the third carrier.