Patent Assignment
Reel/Frame 046328/0741
Assignment of Assignor's Interest
Recorded: 2018-06-08
Pages: 4
Assignors
HU, CHIH-CHIA
Executed: 2018-05-29
KUO, CHUN-CHIANG
Executed: 2018-05-29
JAN, SEN-BOR
Executed: 2018-05-29
CHEN, MING-FA
Executed: 2018-05-29
CHEN, HSIEN-WEI
Executed: 2018-05-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Seal Ring for Hybrid-Bond