Patent Assignment
Reel/Frame 046342/0175
Assignment of Assignor's Interest
Recorded: 2018-07-13
Pages: 10
Assignors
SUGAYA, ISAO
Executed: 2018-06-11
ARIIZUMI, EIJI
Executed: 2018-06-11
KITO, YOSHIAKI
Executed: 2018-06-13
USHIJIMA, MIKIO
Executed: 2018-06-11
ARAMATA, MASANORI
Executed: 2018-06-27
KIRIBE, NAOTO
Executed: 2018-06-25
SHIRASU, HIROSHI
Executed: 2018-06-15
MITSUISHI, HAJIME
Executed: 2018-06-11
Assignee
NIKON CORPORATION
15-3, KONAN 2-CHOME, MINATO-KU, TOKYO, 1086290, JAPAN
Covered Property
(1)
Substrate Bonding Apparatus and Substrate Bonding Method
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Omitted Assignors Previously Recorded at Reel: 046342 Frame: 0175. Assignor(S) Hereby Confirms the Assignment.
Sep 5, 2018
From: SUGAYA, ISAO; ARIIZUMI, EIJI; KITO, YOSHIAKI; USHIJIMA, MIKIO
To: NIKON CORPORATION
Reel/Frame 047375/0539 →
Assignment of Assignor's Interest
Nov 18, 2025
From: NIKON CORPORATION
To: SCREEN HOLDINGS CO., LTD.
Reel/Frame 073611/0008 →