IP Library › Assignment 046344/0423
Patent Assignment
Reel/Frame 046344/0423

Assignment of Assignor's Interest

Recorded: 2018-04-16 Pages: 3
Assignors
YANG, NAI-HAO
Executed: 2018-02-22
SU, HUNG-WEN
Executed: 2018-02-22
CHEN, KUAN-CHIA
Executed: 2018-02-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property (1)
Physical Vapor Deposition Process for Semiconductor Interconnection Structures
Application: 15/880,324 →
Publication: US 2019/0164825
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 1, 2018
From: YANG, NAI-HAO; SU, HUNG-WEN; CHEN, KUAN-CHIA
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 046047/0080 →