IP Library › Assignment 046356/0192
Patent Assignment
Reel/Frame 046356/0192

Assignment of Assignor's Interest

Recorded: 2018-07-16 Pages: 4
Assignors
KIM, DA HEE
Executed: 2017-09-13
KO, YOUNG GWAN
Executed: 2017-09-13
JEONG, SUNG WON
Executed: 2017-09-13
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Fan-Out Semiconductor Package
Application: 16/035,192 →
Publication: US 2018/0342449
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →