Patent Assignment
Reel/Frame 046363/0559
Assignment of Assignor's Interest
Recorded: 2018-07-17
Pages: 4
Assignors
CHEN, JIE
Executed: 2018-06-19
CHEN, HSIEN-WEI
Executed: 2018-06-19
CHEN, YING-JU
Executed: 2018-06-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Three-Dimensional Integrated Circuit Structures