Patent Assignment
Reel/Frame 046374/0728
Assignment of Assignor's Interest
Recorded: 2018-07-17
Pages: 9
Assignors
KANG, MINKYUNG
Executed: 2013-06-26
ROH, YOUNGDAL
Executed: 2013-06-26
JEON, DONG JU
Executed: 2013-06-26
PARK, KYOUNGHEE
Executed: 2013-06-26
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Embedded Pad on Layered Substrate and Method of Manufacture Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.