Patent Assignment
Reel/Frame 046642/0069
Change of Name
Recorded: 2018-07-27
Pages: 4
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65, #04-08/09 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Embedded Pad on Layered Substrate and Method of Manufacture Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 17, 2018
From: KANG, MINKYUNG; ROH, YOUNGDAL; JEON, DONG JU; PARK, KYOUNGHEE
To: STATS CHIPPAC LTD.
Reel/Frame 046374/0728 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →