Patent Assignment
Reel/Frame 046387/0390
Assignment of Assignor's Interest
Recorded: 2018-07-18
Pages: 2
Assignors
CHEN, JIE
Executed: 2018-07-06
CHEN, YING-JU
Executed: 2018-07-06
CHEN, HSIEN-WEI
Executed: 2018-07-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Supporting InFO Packages to Reduce Warpage