IP Library Assignment 046404/0170
Patent Assignment
Reel/Frame 046404/0170

Assignment of Assignor's Interest

Recorded: 2018-07-19 Pages: 6
Assignors
JIANG, YI
Executed: 2018-07-16
HSIEH, CURTIS CHUN-I
Executed: 2018-07-16
YI, WANBING
Executed: 2018-07-16
TAN, JUAN BOON
Executed: 2018-07-16
Assignee
GLOBALFOUNDRIES SINGAPORE PTE. LTD.
60 WOODLANDS INDUSTRIAL PARK D STREET 2, SINGAPORE, 738406, SINGAPORE
Covered Property (1)
Device with Capping Layer for Improved Residue Defect and Method of Production Thereof
Application: 16/038,897 →
Publication: US 2020/0028067