Patent Assignment
Reel/Frame 046432/0566
Assignment of Assignor's Interest
Recorded: 2018-07-23
Pages: 4
Assignees
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANGJIANG ROAD, PUDONG NEW AREA, SHANGHAI, CHINA
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
NO. 18 WEN CHANG RD., ECONOMIC-TECHNOLOGICAL DEVELOPMENT AREA, DAXING DISTRICT, BEIJING, CHINA
Covered Property
(1)
Packaging Structure and Fabrication Method Thereof