Patent Assignment
Reel/Frame 046452/0224
Assignment of Assignor's Interest
Recorded: 2018-07-25
Pages: 4
Assignors
KIM, HYON CHOL
Executed: 2018-05-17
MYUNG, BOK SIK
Executed: 2018-05-18
PARK, OK GYEONG
Executed: 2018-05-18
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Interposer Substrate and Semiconductor Package