IP Library › Assignment 046454/0906
Patent Assignment
Reel/Frame 046454/0906

Certificate of Dissolution

Recorded: 2018-06-28 Pages: 6
Assignor
MATTSON THERMAL PRODUCTS, INC.
Executed: 2007-02-02
Assignee
MATTSON TECHNOLOGY, INC.
47131 BAYSIDE PARKWAY, FREMONT, CALIFORNIA, 94538
Covered Properties (5)
Heating Device for Heating Semiconductor Wafers in Thermal Processing Chambers
Patent: 6,771,895 →
Application: 09/226,396 →
Publication: US 2002/0017618
Heating Device for Heating Semiconductor Wafers in Thermal Processing Chambers
Patent: 6,717,158 →
Application: 09/478,247 →
Heating Device for Heating Semiconductor Wafers in Thermal Processing Chambers
Patent: 7,038,174 →
Application: 10/903,424 →
Publication: US 2005/0008351
Heating Device for Heating Semiconductor Wafers in Thermal Processing Chambers
Patent: 7,608,802 →
Application: 11/399,085 →
Publication: US 2006/0201927
Heating Device for Heating Semiconductor Wafers in Thermal Processing Chambers
Patent: 8,138,451 →
Application: 12/574,441 →
Publication: US 2010/0018960
Related Assignments (6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 26, 2018
From: GAT, ARNON; O'CARROLL, CONOR PATRICK; TIMANS, PAUL JANIS; CHOY, SHUEN CHUN
To: STEAG RTP SYSTEMS, INC.
Reel/Frame 046202/0100 →
Assignment of Assignor's Interest Jun 28, 2018
From: GAT, ARNON; BOGART, BOB
To: STEAG RTP SYSTEMS, INC.
Reel/Frame 046230/0939 →
Change of Name Jun 28, 2018
From: STEAG RTP SYSTEMS, INC.
To: MATTSON THERMAL PRODUCTS, INC.
Reel/Frame 046453/0575 →
Security Interest Aug 27, 2018
From: MATTSON TECHNOLOGY, INC.
To: EAST WEST BANK
Reel/Frame 046956/0348 →
Assignment of Assignor's Interest Sep 30, 2019
From: MATTSON TECHNOLOGY, INC.
To: MATTSON TECHNOLOGY, INC.; BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY, CO., LTD
Reel/Frame 050582/0796 →
Release of Security Interest Apr 15, 2021
From: EAST WEST BANK
To: MATTSON TECHNOLOGY, INC.
Reel/Frame 055950/0452 →