IP Library › Assignment 046456/0172
Patent Assignment
Reel/Frame 046456/0172

Assignment of Assignor's Interest

Recorded: 2018-07-25 Pages: 3
Assignors
WU, JYUN-LIN
Executed: 2018-06-25
LIN, LIANG-CHEN
Executed: 2018-06-25
SU, SHIANG-RUEI
Executed: 2018-06-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property (1)
Semiconductor Structure and Manufacturing Method for the Same
Application: 16/017,498 →
Publication: US 2019/0393186