Patent Assignment
Reel/Frame 046467/0513
Assignment of Assignor's Interest
Recorded: 2018-07-02
Pages: 4
Assignor
LI, JIANWEN
Executed: 2018-07-02
Assignee
SHANGHAI DENGLIN TECHNOLOGIES CO., LTD
149 NICHENG RD., BUILDING 5, SUITE 309, NICHENG TOWN, PUDONG DISTRICT, SHANGHAI, CHINA
Covered Property
(1)
Configurable Random-Access Memory (Ram) Array Including Through-Silicon via (Tsv) Bypassing Physical Layer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.