Patent Assignment
Reel/Frame 046468/0649
Assignment of Assignor's Interest
Recorded: 2018-07-02
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2018-06-12
YEH, SUNG-FENG
Executed: 2018-06-12
CHEN, MING-FA
Executed: 2018-06-12
CHEN, HSIEN-WEI
Executed: 2018-06-12
LIU, TZUAN-HORNG
Executed: 2018-06-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device Packaging Structure Having Through Interposer Vias and Through Substrate Vias