Patent Assignment
Reel/Frame 046488/0554
Assignment of Assignor's Interest
Recorded: 2018-07-27
Pages: 5
Assignors
WU, CHIH-WEI
Executed: 2018-04-23
SHIH, YING-CHING
Executed: 2018-04-23
LU, SZU-WEI
Executed: 2018-04-23
LIN, JING-CHENG
Executed: 2018-05-05
LEE, LONG HUA
Executed: 2018-04-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Fan-Out Packages and Methods of Forming the Same