Patent Assignment
Reel/Frame 046514/0632
Assignment of Assignor's Interest
Recorded: 2018-07-31
Pages: 2
Assignors
MA, WEI YU
Executed: 2014-04-28
CHEN, CHIA-HUI
Executed: 2014-04-28
CHEN, KUO-JI
Executed: 2014-04-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Forming Three-Dimensional Integrated Circuit Having Esd Protection Circuit