Patent Assignment
Reel/Frame 046519/0918
Assignment of Assignor's Interest
Recorded: 2018-07-31
Pages: 4
Assignors
CHU, YUNG-CHI
Executed: 2018-06-19
KUO, HUNG-JUI
Executed: 2018-06-26
WANG, JHIH-YU
Executed: 2018-06-26
HU, YU-HSIANG
Executed: 2018-06-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof