Patent Assignment
Reel/Frame 046531/0894
Assignment of Assignor's Interest
Recorded: 2018-07-12
Pages: 7
Assignors
PARK, JAE-HYUN
Executed: 2018-05-24
BAEK, KYE-HYUN
Executed: 2018-05-24
JEON, YONG-HO
Executed: 2018-05-25
KIM, CHEOL
Executed: 2018-05-25
PARK, SUNG-IL
Executed: 2018-05-24
LEE, YUN-IL
Executed: 2018-05-25
LEE, HYUNG-SUK
Executed: 2018-05-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device and Method of Forming the Same