Integrated circuit device and method of forming the same
An integrated circuit (IC) device includes a first region and a second region adjacent to each other along a first direction on a substrate, fin patterns in each of the first and second regions extending along a second direction perpendicular to the first direction; gate electrodes extending along the first direction and intersecting the fin patterns; and an isolation region between the first and second regions, a bottom of the isolation region having a non-uniform height relative to a bottom of the substrate.
1. An integrated circuit (IC) device, comprising:
a first region and a second region adjacent to each other along a first direction on a substrate;
fin patterns in each of the first and second regions extending along a second direction perpendicular to the first direction;
gate electrodes extending along the first direction and intersecting the fin patterns; and
an isolation region between the first and second regions, a bottom of the isolation region having a non-uniform height relative to a bottom of the substrate along the second direction, and an entirety of a width of the isolation region along the first direction being between two of the fin patterns that are directly adjacent to each other along the first direction.
2. The IC device as claimed in claim 1 , wherein:
the isolation region includes at least one first portion and at least one second portion, the at least one first portion being between two gate electrodes adjacent to each other along the first direction, and the at least one second portion being between two gate electrodes adjacent to each other along the second direction, and
a distance between the bottom of the substrate and a bottom of the at least one first portion being smaller than a distance between the bottom of the substrate and a bottom of the at least one second portion.
3. The IC device as claimed in claim 2 , wherein the at least one first portion fills a space between the two gate electrodes adjacent to each other along the first direction, and the at least one second portion extends from the at least one first portion in the second direction.
4. The IC device as claimed in claim 3 , wherein the at least one second portion fills a space between two first portions adjacent to each other along the second direction.
5. The IC device as claimed in claim 2 , wherein the first and second portions are integral with each other in a single, seamless structure, top surfaces of the first and second portions being level with each other, and widths of the first and second portions being equal to each other along the first direction.
6. The IC device as claimed in claim 2 , further comprising source/drain regions on the fin patterns, a center of the at least one second portion being between source/drain regions of adjacent fin patterns of the fin patterns.
7. The IC device as claimed in claim 2 , wherein:
each of the gate electrodes includes a gate line and a dielectric film on a bottom surface and side surfaces of the gate line, and
a distance between the bottom of the substrate and a bottom of the at least one first portion is smaller than a distance between the bottom of the substrate and a bottommost surface of the dielectric film of an adjacent one of the gate electrodes, and a distance between the bottom of the substrate and a bottom of the at least one second portion is larger than a distance between the bottom of the substrate and the bottommost surface of the dielectric film of the adjacent one of the gate electrodes.
8. The IC device as claimed in claim 2 , wherein the at least one first portion of the isolation region directly contacts the two gate electrodes.
9. The IC device as claimed in claim 1 , wherein the isolation region includes a first portion and a second portion, the first portion having a prismatic shape, and the second portion including protrusions extending from the prismatic shape toward the substrate.
10. The IC device as claimed in claim 9 , wherein each protrusion is between two gate electrodes of the first and second regions, respectively.
11. The IC device as claimed in claim 10 , wherein each protrusion is collinear with the two gate electrodes of the first and second regions, respectively.
12. The IC device as claimed in claim 9 , wherein the protrusions are spaced apart from each other along the second direction.
13. The IC device as claimed in claim 1 , wherein the isolation region has a non-overlapping relationship with the two of the fin patterns in a top view.
14. The IC device as claimed in claim 13 , wherein the isolation region has a non-overlapping relationship with the gate electrodes in the top view.
15. The IC device as claimed in claim 1 , further comprising an inter-gate dielectric film between the gate electrodes, the inter-gate dielectric film including a material having a lower etch rate than a material of the gate electrodes.
16. The IC device as claimed in claim 2 , further comprising gate insulating capping layers on the gate electrodes, respectively, a bottom of the second portion of the isolation region being level with bottoms of the gate insulating capping layers, and a bottom of the first portion of the isolation region extending beyond bottommost surfaces of the gate electrodes toward the substrate.
17. An integrated circuit (IC) device, comprising:
fin patterns on a substrate along a first direction;
gate electrodes along a second direction perpendicular to the first direction;
source/drain regions on the fin patterns; and
an isolation region between and in parallel with two adjacent fin patterns of the fin patterns, the isolation region separating at least one gate electrode of the gate electrodes into first and second gate electrodes,
wherein the isolation region includes a first portion between the first and second gate electrodes, and a second portion having a non-overlapping relationship with the first and second gate electrodes in the first direction, as viewed in a top view, a thickness of the first portion being larger than a thickness of the second portion, the thicknesses being measured along a direction normal to a bottom of the substrate, and
wherein the isolation region is a continuous insulating structure, an entirety of the isolation region being between the two adjacent fin patterns of the fin patterns, and top surfaces of the first and second portions being level.
18. An integrated circuit (IC) device, comprising:
a first region and a second region adjacent to each other along a first direction on a substrate;
fin patterns in each of the first and second regions extending along a second direction perpendicular to the first direction;
gate electrodes extending along the first direction and intersecting the fin patterns; and
an isolation region between the first and second regions, a bottom of the isolation region having a non-uniform height relative to a bottom of the substrate and an entirety of a width of the isolation region along the first direction being between two of the fin patterns that are directly adjacent to each other along the first direction,
wherein the isolation region has a non-overlapping relationship with the two of the fin patterns in a top view, and the isolation region has a non-overlapping relationship with the gate electrodes, in the top view.