Patent Assignment
Reel/Frame 046535/0115
Assignment of Assignor's Interest
Recorded: 2018-08-02
Pages: 5
Assignors
SUGO, YUKI
Executed: 2018-04-08
KAMAKURA, NAO
Executed: 2018-05-04
HONDA, SATOSHI
Executed: 2018-04-09
Assignee
NITTO DENKO CORPORATION
1-1-2, SHIMOHOZUMI, IBARAKI-SHI, OSAKA, 567-8680, JAPAN
Covered Property
(1)
Thermal Bonding Sheet, Thermal Bonding Sheet with Dicing Tape, Bonded Body Production Method, and Power Semiconductor Device