Thermal bonding sheet, thermal bonding sheet with dicing tape, bonded body production method, and power semiconductor device
A thermal bonding sheet includes a pre-sintering layer containing copper particles and polycarbonate.
1. A thermal bonding sheet comprising a pre-sintering layer containing a mixture of copper particles and polypropylene carbonate.
2. The thermal bonding sheet according to claim 1 , wherein the copper particles have an average particle size in a range of 10 to 1000 nm.
3. The thermal bonding sheet according to claim 1 , wherein
each of the copper particles is composed of a plurality of crystallites; and
each of the crystallites has a crystallite diameter of 50 nm or less.
4. A thermal bonding sheet with dicing tape, comprising:
a dicing tape; and
the thermal bonding sheet according to claim 1 stacked on the dicing tape.
5. A bonded body production method comprising the steps of:
preparing the thermal bonding sheet according to claim 1 ; and
thermally bonding two objects to be bonded with the thermal bonding sheet interposed between the two objects to be bonded,
wherein a bonding temperature in the thermal bonding step is in a range of 200 to 400° C.
6. The method according to claim 5 , wherein the thermal bonding step is performed in a nitrogen atmosphere, in a reduced pressure, or in a reducing gas atmosphere.
7. A power semiconductor device comprising:
the thermal bonding sheet according to claim 1 ; and
a power semiconductor element.