Patent Assignment
Reel/Frame 046537/0226
Assignment of Assignor's Interest
Recorded: 2018-08-02
Pages: 6
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU,, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device and the Semiconductor Device