Patent Assignment
Reel/Frame 046538/0194
Assignment of Assignor's Interest
Recorded: 2018-08-02
Pages: 6
Assignors
KO, JI-HAN
Executed: 2018-07-27
KANG, BO RAM
Executed: 2018-07-27
KIM, DONG KWAN
Executed: 2018-07-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Boards with Anti-Warping Molding Portions and Related Semiconductor Packages and Methods of Fabricating