Patent Assignment
Reel/Frame 046546/0012
Assignment of Assignor's Interest
Recorded: 2018-08-03
Pages: 6
Assignors
WANG, CHUEI-TANG
Executed: 2018-07-23
TSAI, CHUNG-HAO
Executed: 2018-07-18
YU, CHEN-HUA
Executed: 2018-07-18
LU, CHUN-LIN
Executed: 2018-07-18
SHIH, CHAO-WEN
Executed: 2018-07-19
PU, HAN-PING
Executed: 2018-07-19
WU, KAI-CHIANG
Executed: 2018-07-19
WAN, ALBERT
Executed: 2018-07-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Package Structure Having Connecting Module