Patent Assignment
Reel/Frame 046570/0860
Assignment of Assignor's Interest
Recorded: 2018-08-07
Pages: 5
Assignors
CHOI, JOO YOUNG
Executed: 2018-05-30
KIM, JOON SUNG
Executed: 2018-05-30
KIM, YOUNG MIN
Executed: 2018-05-30
KIM, DA HEE
Executed: 2018-05-30
KIM, TAE WOOK
Executed: 2018-05-30
KIM, BYUNG HO
Executed: 2018-05-30
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package with Improved Flatness of an Insulating Layer Formed on Patterns
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.