Patent Assignment
Reel/Frame 046589/0330
Assignment of Assignor's Interest
Recorded: 2018-08-08
Pages: 2
Assignors
HU, YU-HSIANG
Executed: 2018-07-31
KUO, HUNG-JUI
Executed: 2018-07-31
YU, CHEN-HUA
Executed: 2018-07-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Redistribution Structures for Semiconductor Packages and Methods of Forming the Same