Patent Assignment
Reel/Frame 046593/0651
Assignment of Assignor's Interest
Recorded: 2018-08-09
Pages: 4
Assignors
HAN, SEUNG HUN
Executed: 2018-07-19
CHO, SUNG MIN
Executed: 2018-07-19
OH, DONG JOON
Executed: 2018-07-19
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Electronic Component and Method of Manufacturing the Same