IP Library › Assignment 046609/0489
Patent Assignment
Reel/Frame 046609/0489

Assignment of Assignor's Interest

Recorded: 2018-08-10 Pages: 3
Assignors
SUBBAREDDY, DHEERAJ
Executed: 2018-07-30
NALAMALPU, ANKIREDDY
Executed: 2018-07-30
HOSSAIN, MD ALTAF
Executed: 2018-07-30
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Innovative Interconnect Design for Package Architecture to Improve Latency
Application: 16/023,846 →
Publication: US 2019/0131268
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 19, 2024
From: INTEL CORPORATION
To: ALTERA CORPORATION
Reel/Frame 066353/0886 →
Security Interest Sep 12, 2025
From: ALTERA CORPORATION
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 073431/0309 →