Patent Assignment
Reel/Frame 046610/0667
Assignment of Assignor's Interest
Recorded: 2018-08-10
Pages: 4
Assignors
TSAI, WAN-LIN
Executed: 2017-10-02
PAN, SHING-CHYANG
Executed: 2017-10-02
LIN, SUNG-EN
Executed: 2017-10-02
LEE, TZE-LIANG
Executed: 2017-10-02
SHIU, JUNG-HAU
Executed: 2017-10-02
WANG, JEN-HUNG
Executed: 2017-10-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
High Aspect Ratio Gap Fill