High aspect ratio gap fill
The present disclosure describes a method of forming a dielectric layer or a dielectric stack on a photoresist layer while minimizing or avoiding damage to the photoresist. In addition, the dielectric layer or dielectric stack can till high-aspect ratio openings and can be removed with etching. The dielectric layer or dielectric stack can be deposited with a conformal, low-temperature chemical vapor deposition process or a conformal, low-temperature atomic layer deposition process that utilizes a number of precursors and plasmas or reactant gases.
1. A method comprising:
forming a plurality of patterned structures over a substrate;
forming a spacer material over the plurality of patterned structures;
disposing a photoresist layer over the spacer material;
forming one or more openings in the photoresist layer to expose a portion of the spacer material;
depositing a material stack comprising a bottom layer and a top layer over the photoresist layer to fill the one or more openings, wherein the depositing the material stack comprises:
depositing the bottom layer conformally on the photoresist layer with an oxygen-free process, and
depositing the top layer to fill the one or more openings; and
etching the material stack and the photoresist layer until the spacer material is exposed.
2. The method of claim 1 , further comprising:
removing the spacer material over a top surface of the plurality of patterned structures.
3. The method of claim 1 , wherein the depositing the material stack comprises depositing the material stack with a plasma-enhanced chemical vapor deposition (PECVD) or a plasma-enhanced atomic layer deposition (PEALD) process.
4. The method of claim 3 , wherein the PECVD or PEALD process uses a tris(dimethylamino)silane (3DMAS), a tetrakis(dimethylamino)titanium (TDMAT), a bis(tertiary-butyl-amino)silane (BTBAS), or a bis(diethylamino)silane (BDEAS) precursor and an argon, a nitrogen, or a nitrogen-based plasma.
5. The method of claim 3 , wherein the PECVD or PEALD process comprises a processing temperature below 300° C.
6. The method of claim 1 , wherein the one or more openings have an aspect ratio greater than 10 to 1.
7. A method comprising:
forming a plurality of patterned structures over a substrate, wherein each of the plurality of patterned structures has a top surface;
forming a spacer material over the plurality of patterned structures;
disposing a photoresist layer over the spacer material;
forming an opening in the photoresist layer to expose a portion of the spacer material;
depositing a material stack in the opening, the material stack comprising a bottom layer and a top layer, wherein the depositing the material stack comprises:
depositing the bottom layer conformally on the photoresist layer; and
depositing the top layer to fill the opening;
etching the material stack and the photoresist layer until the spacer material is exposed; and
removing the spacer material over the top surface of the plurality of patterned structures and over the substrate.
8. The method of claim 7 , wherein the depositing the bottom layer comprises depositing the bottom layer with a tris(dimethylamino)silane (3DMAS), a tetrakis(dimethylamino)titanium (TDMAT), a bis(tertiary-butyl-amino)silane (BTBAS), or a bis(diethylamino)silane (BDEAS) precursor and with an argon, a nitrogen, or a nitrogen-based plasma.
9. The method of claim 7 , wherein the depositing the top layer comprises depositing the top layer with a tris(dimethylamino)silane (3DMAS), a tetrakis(dimethylamino)titanium (TDMAT), a bis(tertiary-butyl-amino)silane (BTBAS), or a bis(diethylamino)silane (BDEAS) precursor and with an oxygen, a carbon dioxide, or a nitrous oxide reactant gas or plasma.
10. The method of claim 7 , wherein the depositing the bottom and top layers comprises depositing the bottom and top layers with a plasma-enhanced chemical vapor deposition (PECVD) process or a plasma-enhanced atomic layer deposition (PEALD) process.
11. The method of claim 7 , wherein the depositing the top layer comprises depositing the top layer with a thermal chemical vapor deposition (CVD) process or a thermal atomic layer deposition (ALD) process.
12. The method of claim 7 , wherein the depositing the bottom and top layers comprises depositing the bottom and top layers at a temperature below 300° C.
13. A method comprising:
forming a plurality of patterned structures over a substrate;
forming a spacer material over the plurality of patterned structures;
disposing a first material stack over the spacer material, wherein the first material stack comprises a photoresist bottom layer and a hard mask top layer; the photoresist bottom layer covering the spacer material;
forming an opening with an aspect ratio greater than 0.0 to 1 in the first material stack to expose a portion of the spacer material; and
depositing a second material stack over the first material stack to fill the opening, the second material stack comprising a second bottom layer and a second top layer, wherein the second bottom layer is formed on the photoresist bottom layer and the hard mask top layer, and wherein the second top layer fills the opening.
14. The method of claim 13 , further comprising:
concurrently removing the first material stack and the second material stack until the spacer material is exposed; and
removing the spacer material over a top surface of the plurality of patterned structures and over the substrate.
15. The method of claim 13 , wherein the depositing the second material stack comprises depositing the second bottom layer with a tris(dimethylamino)silane (3DMAS), a tetrakis(dimethylamino)titanium (TDMAT), a bis(tertiary-butyl-amino)silane (BTBAS), or a bis(diethylamino)silane (BDEAS) precursor and with an argon, a nitrogen, or a nitrogen-based plasma.
16. The method of claim 13 , wherein the depositing the second material stack comprises depositing the second top layer with a tris(dimethylamino)silane (3DMAS), a tetrakis(dimethylamino)titanium (TDMAT), a bis(tertiary-butyl-amino)silane (BTBAS), or a bis(diethylamino)silane (BDEAS) precursor and with an oxygen, a carbon dioxide, or a nitrous oxide reactant gas or plasma.
17. The method of claim 13 , wherein the depositing the second material stack comprises depositing the second bottom layer with a plasma-enhanced chemical vapor process (PECVD) or a plasma-enhanced atomic layer deposition (PEALD) process.
18. The method of claim 17 , wherein the PECVD or PEALD process comprises a deposition temperature below 300° C.
19. The method of claim 13 , wherein the depositing the second material stack comprises depositing the second top layer with a thermal chemical vapor deposition (CND) process or atomic layer deposition (ALD) process.
20. The method of claim 13 , wherein the depositing the second material stack comprises depositing the second top layer with a plasma-enhanced chemical vapor deposition (PECVD) process or a plasma-enhanced atomic layer deposition (PEALD) process, wherein the PECVD or PEALD process comprises a deposition temperature below 300° C.