Patent Assignment
Reel/Frame 046611/0496
Assignment of Assignor's Interest
Recorded: 2018-08-10
Pages: 4
Assignors
WAN, ZHIMIN
Executed: 2018-08-08
CHANG, JE-YOUNG
Executed: 2018-08-08
CHIU, CHIA-PIN
Executed: 2018-08-08
DEVASENATHIPATHY, SHANKAR
Executed: 2018-08-08
GEBREHIWOT, BETSEGAW KEBEDE
Executed: 2018-08-08
JHA, CHANDRA MOHAN
Executed: 2018-08-08
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Thermal Assemblies for Multi-Chip Packages