Thermal assemblies for multi-chip packages
Disclosed herein are thermal assemblies for multi-chip packages (MCPs), as well as related methods and devices. For example, in some embodiments, a thermal assembly for an MCP may include a heat pipe having a ring shape.
1. An apparatus, comprising:
a package substrate for a multi-chip package (MCP);
an IC component coupled to a surface of the package substrate; and
a thermal assembly, including:
a lid having legs perpendicular to the surface of the package substrate, the legs coupled to the surface of the package substrate with a sealant such that the IC component is between the lid and the package substrate, and the lid further comprises:
a heat pipe having a ring shape, the heat pipe including:
an interior portion configured for flow of a working fluid;
a thermally conductive outer envelope surrounding the interior portion;
a wicking material between the interior portion and the outer envelope;
a thermally conductive region in an opening of the heat pipe; and
a thermally insulative region between the heat pipe and the thermally conductive region, wherein the thermally insulative region includes epoxy.
2. The apparatus of claim 1 , wherein the thermally conductive region includes copper or aluminum.
3. The apparatus of claim 1 , further comprising:
a plurality of IC components coupled to the package substrate.
4. The apparatus of claim 3 , wherein the plurality of IC components include at least one inner IC component and a plurality of outer IC components, and the heat pipe extends at least partially over the outer IC components.
5. The apparatus of claim 4 , wherein an opening of the heat pipe extends at least partially over the at least one inner IC component.
6. The apparatus of claim 5 , further comprising:
a thermally conductive region in an opening of the heat pipe,
wherein the thermally conductive region is aligned with at least one outer edge of the at least one inner IC component.
7. The apparatus of claim 5 , wherein at least one of the outer IC components include high bandwidth memory (HBM).
8. The apparatus of claim 5 , wherein the at least one inner IC component includes a central processing unit (CPU) or a graphics processing unit (GPU).
9. The apparatus of claim 6 , wherein the thermally conductive region includes copper or aluminum.
10. The apparatus of claim 9 , further comprising:
a thermally insulative region between the heat pipe and the thermally conductive region.
11. The apparatus of claim 10 , wherein the thermally insulative region includes epoxy.
12. The apparatus of claim 4 , further comprising:
a thermally conductive region in an opening of the heat pipe,
wherein the thermally conductive region is aligned with at least one outer edge of the at least one inner IC component.
13. The apparatus of claim 12 , wherein the thermally conductive region includes copper or aluminum.
14. The apparatus of claim 12 , further comprising:
a thermally insulative region between the heat pipe and the thermally conductive region.
15. The apparatus of claim 14 , wherein the thermally insulative region includes epoxy.
16. The apparatus of claim 4 , wherein at least one of the outer IC components include high bandwidth memory (HBM).
17. The apparatus of claim 4 , wherein the at least one inner IC component includes a central processing unit (CPU) or a graphics processing unit (GPU).
18. An apparatus, comprising:
a package substrate;
an IC component coupled to a surface of the package substrate; and
a lid coupled to the IC component and the package substrate, wherein the lid comprises:
a top portion parallel to the surface of the package substrate, the top portion coupled to the IC component;
a bottom portion perpendicular to the surface of the package substrate, the bottom portion coupled to the package substrate with a sealant; and
a ring-shaped heat pipe in the top portion, wherein the heat pipe includes:
a channel configured for flow of a working fluid;
a thermally conductive outer envelope surrounding the channel; and
a wicking material between the channel and the outer envelope;
a thermally conductive region in an opening of the heat pipe; and
a thermal insulator between the heat pipe and the thermally conductive region, wherein the thermal insulator includes epoxy.
19. The apparatus of claim 18 , wherein the top portion comprises peripheral zone and a medial zone, the peripheral zone comprising the heat pipe, and the medial zone comprising the thermally conductive region.
20. The apparatus of claim 19 , wherein the peripheral zone and the medial zone are separated by the thermal insulator.
21. The apparatus of claim 18 , further comprising a heat sink having a base and fins, the base being coupled to the top portion of the lid opposite to the IC component.
22. The apparatus of claim 18 , further comprising a plurality of IC components coupled to the lid, between the top portion of the lid and the package substrate.