IP Library › Assignment 046618/0743
Patent Assignment
Reel/Frame 046618/0743

Assignment of Assignor's Interest

Recorded: 2018-08-10 Pages: 4
Assignors
SEDDON, MICHAEL J.
Executed: 2016-08-22
CARNEY, FRANCIS J.
Executed: 2016-08-22
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL RD., MD A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Through-Substrate via Structure and Method of Manufacture
Application: 16/101,259 →
Publication: US 2018/0350733
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Nov 1, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047399/0631 →
Release of Security Interest in Patents Recorded at Reel 047399, Frame 0631 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064078/0001 →