Patent Assignment
Reel/Frame 046658/0766
Assignment of Assignor's Interest
Recorded: 2018-08-22
Pages: 7
Assignors
JO, KWONSOON
Executed: 2018-07-16
KANG, SEO-GOO
Executed: 2018-07-13
SON, YOUNGHWAN
Executed: 2018-07-16
KANAMORI, KOHJI
Executed: 2018-07-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Semiconductor Memory Devices Including Through-Interconnection Structures