Patent Assignment
Reel/Frame 046732/0539
Assignment of Assignor's Interest
Recorded: 2018-08-29
Pages: 4
Assignors
KWON, YI EOK
Executed: 2018-08-06
LEE, JAE EAN
Executed: 2018-08-06
LEE, HAK YOUNG
Executed: 2018-08-06
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package
Application:
16/105,956 →
Publication:
US 2019/0229070
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.