IP Library Assignment 046757/0042
Patent Assignment
Reel/Frame 046757/0042

Assignment of Assignor's Interest

Recorded: 2018-08-30 Pages: 11
Assignors
RICHARDSON, THOMAS B.
Executed: 2017-10-04
ABYS, JOSEPH A.
Executed: 2018-08-30
SHAO, WENBO
Executed: 2018-08-30
WANG, CHEN
Executed: 2018-08-20
PANECCASIO, VINCENT
Executed: 2018-08-02
WANG, CAI
Executed: 2017-10-05
LIN, SEAN XUAN
Executed: 2018-08-17
ANTONELLIS, THEODORE
Executed: 2018-07-12
Assignee
MACDERMID ENTHONE INC.
245 FREIGHT STREET, WATERBURY, CONNECTICUT, 06702
Covered Property (1)
Process for Filling Vias in the Microelectronics
Application: 15/148,738 →
Publication: US 2016/0254156
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Feb 5, 2019
From: MACDERMID ENTHONE INC. (F/K/A ENTHONE INC.)
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 048261/0110 →
Assignment of Security Interest in Patent Collateral Nov 17, 2022
From: BARCLAYS BANK PLC
To: CITIBANK, N.A.
Reel/Frame 061956/0643 →