Patent Assignment
Reel/Frame 046763/0325
Assignment of Assignor's Interest
Recorded: 2018-08-10
Pages: 3
Assignors
SUBBAREDDY, DHEERAJ
Executed: 2018-07-30
NALAMALPU, ANKIREDDY
Executed: 2018-07-30
HOSSAIN, MD ALTAF
Executed: 2018-07-30
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Interface Bus for Inter-Die Communication in a Multi-Chip Package Over High Density Interconnects
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.