Patent Assignment
Reel/Frame 046786/0879
Assignment of Assignor's Interest
Recorded: 2018-09-05
Pages: 4
Assignors
WAN, CHENG-TIEN
Executed: 2018-09-03
HUANG, YAO-TSUNG
Executed: 2018-09-03
HUANG, YUN-SAN
Executed: 2018-09-03
LEE, MING-CHENG
Executed: 2018-09-03
HUANG, WEI-CHE
Executed: 2018-09-03
Assignee
MEDIATEK INC.
NO.1, DUSING 1ST RD., HSINCHU SCIENCE PARK, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Chip and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.