Patent Assignment
Reel/Frame 046790/0903
Assignment of Assignor's Interest
Recorded: 2018-09-05
Pages: 2
Assignor
YONEDA, YOSHIHIRO
Executed: 2018-08-08
Assignee
MITSUI MINING & SMELTING CO., LTD.
1-11-1 OSAKI, SHINAGAWA-KU, TOKYO, 141-8584, JAPAN
Covered Property
(1)
Multilayer Laminate and Method for Producing Multilayer Printed Wiring Board Using Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.