Patent Assignment
Reel/Frame 046842/0914
Assignment of Assignor's Interest
Recorded: 2018-09-11
Pages: 3
Assignors
LIU, HSIANG-WEI
Executed: 2018-08-24
CHU, WEI-CHEN
Executed: 2018-08-24
WU, CHIA-TIEN
Executed: 2018-08-24
YANG, TAI-I
Executed: 2018-08-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Interconnect Structure and Manufacturing Method for the Same