Patent Assignment
Reel/Frame 046890/0425
Assignment of Assignor's Interest
Recorded: 2018-09-17
Pages: 7
Assignors
CHEN, HSIN-LIANG
Executed: 2018-04-27
YEN, CHEN-HSUAN
Executed: 2018-04-27
LO, HAN-TANG
Executed: 2018-09-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Structures and Methods for Heat Dissipation of Semiconductor Devices