Patent Assignment
Reel/Frame 046921/0772
Assignment of Assignor's Interest
Recorded: 2018-08-23
Pages: 2
Assignor
YASUKAWA, HIROHISA
Executed: 2018-07-20
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
Covered Property
(1)
Semiconductor Device, Electronic Module, Electronic Apparatus Each Having Stacked Embedded Active Components in Multilayer Wiring Board and Method for Producing the Semiconductor Device Having the Same