Patent Assignment
Reel/Frame 046976/0290
Assignment of Assignor's Interest
Recorded: 2018-09-26
Pages: 6
Assignors
YOSHIDA, MOTORU
Executed: 2018-07-03
SUEHIRO, YOSHIYUKI
Executed: 2018-07-02
SUGAHARA, KAZUYUKI
Executed: 2018-07-13
NAKANISHI, YOSUKE
Executed: 2018-07-02
YOKOYAMA, YOSHINORI
Executed: 2018-07-10
SODA, SHINNOSUKE
Executed: 2018-07-04
HAYASHI, KOMEI
Executed: 2018-07-25
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 1008310, JAPAN
Covered Property
(1)
Semiconductor Device and Method for Manufacturing Same, for Releaved Stress and High Heat Conductivity